San Francisco: Global chip-maker Qualcomm has unveiled Wi-Fi 7-capable chipsets as a part of its new "Immersive Home Platform", which are built to support the latest high-speed broadband connections and an array of high-performance devices. The new Wi-Fi 7 Immersive Platform will deliver more than 20 Gbps of total system capacity in a compact, power-efficient, cost-effective network chipset architecture, according to the company.
"We developed the Qualcomm Immersive Home Platform to enable high-performance connectivity in a cost-effective, low-profile form factor delivering the newest innovations in home networking" Nick Kucharewski, senior vice president and general manager, Wireless Infrastructure and Networking, Qualcomm Technologies said in a statement.
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The new Qualcomm chips are currently being sampled by manufacturers of home routers and mesh Wi-Fi devices, and they are expected to be available in the second half of 2023. The chipset is also engineered to enable collaboration, telepresence, AR/VR, and immersive gaming applications of today's and tomorrow's home, said the company.
The new Wi-Fi 7 technology is designed to offer maximum connectivity to the latest high-performance devices, delivering peak speeds of up to 5.8 Gbps to a single connected device. Qualcomm's new platform also includes a mesh networking technology known as Multi-Link Mesh. The company says it can reduce real-time latency by 75 per cent for lag-free gaming experiences. It uses Adaptive Interference Puncturing to avoid congested home environments and avoidance algorithms to avoid interference from other networks. (IANS)
(This story has not been edited by ETV Bharat and is auto-generated from a syndicated feed.)
