Seoul: Samsung Electronics released a new multi-chip package (MCP) memory product for use in 5G smartphones as the South Korean tech giant tries to better target the fast-growing handset market.
The world's largest memory chip producer said it has begun mass-producing low-power double data rate 5 (LPDDR5) universal flash storage (UFS) MCP that integrates high-performance DRAM and NAND flash memory chips in a single compact package.
The latest MCP comes with Samsung's LPDDR5 mobile DRAM that boasts 25 gigabytes (GB) per second read/write speed, which is 1.5 times faster than that of the previous LPDDR4X, while the performance of UFS 3.1 interface-based NAND flash has been doubled to 3GB/s compared to the previous UFS 2.2 solution.
Samsung will offer various storage capacity options to meet the diverse needs of its customers, with DRAM ranging from 6GB to 12GB and NAND flash ranging from 128GB to 512GB.